PENGARUH CHAMFER 30° PADA LAS GESEK ALUMINIUM DAN TEMBAGA BERDASARKAN ANALISIS SEM-EDX MAPPING

Fadly Juandinar; Riyan Ariyansyah;

ABSTRAK

Pengaruh Chamfer 30° pada Las Gesek Aluminium danTembaga Berdasarkan Analisis SEM-EDX Mapping

Fadly Juandinar

Sambungan logam tak sejenis aluminium dan tembaga banyak digunakan pada aplikasi kelistrikan
dan otomotif karena kombinasi konduktivitas listrik tembaga dan massa jenis rendah aluminium.
Namun, perbedaan sifat fisik dan termal keduanya sering menyebabkan terbentuknya zona difusi
dan senyawa intermetalik yang memengaruhi kualitas ikatan antarmuka pada proses las gesek.
Permasalahan utama dalam penelitian ini adalah bagaimana variasi geometri chamfer 30° dengan
kedalaman berbeda memengaruhi jarak difusi unsur dan karakter distribusi komposisi Al–Cu pada
sambungan. Penelitian ini bertujuan untuk menganalisis pengaruh variasi kedalaman chamfer
terhadap zona difusi menggunakan metode karakterisasi scanning electron microscope–Energy
dispersive x-ray (SEM–EDX) mapping. Hasil penelitian menunjukkan bahwa pada chamfer 2 mm
difusi unsur berkembang hingga sekitar 5 μm dengan komposisi 70,26 wt% Al (84,12 at%) dan
28,93 wt% Cu (14,71 at%). Pada chamfer 4 mm jarak difusi meningkat menjadi 10 μm dengan
komposisi 77,76 wt% Al (88,43 at%) dan 21,27 wt% Cu (10,27 at%), serta distribusi unsur lebih
merata. Sementara itu, chamfer 6 mm menunjukkan difusi hingga 15 μm dengan komposisi 77,43
wt% Al (86,67 at%) dan 20,53 wt% Cu (9,76 at%). Secara keseluruhan, variasi kedalaman
chamfer 30° memengaruhi jarak dan karakter difusi unsur pada antarmuka, di mana kedalaman 4
mm menunjukkan distribusi komposisi paling seragam dibandingkan variasi lainnya

Kata kunci: las gesek, chamfer 30°, aluminium AA6061, tembaga, SEM–EDX mapping, struktur mikro

The Effect of a 30° Chamfer on Friction Welding of Aluminum and Copper Based on SEM-EDX Mapping Analysis

Fadly Juandinar

Dissimilar metal joints of aluminum and copper are widely used in electrical and automotive
applications due to the combination of copper's electrical conductivity and aluminum's low
density. However, the differences in their physical and thermal properties often cause the
formation of diffusion zones and intermetallic compounds that affect the quality of the interface
bond in the friction welding process. The main issue in this study is how variations in the geometry
of a 30° chamfer with different depths affect the diffusion distance of elements and the distribution
characteristics of the Al–Cu composition at the joint. This study aims to analyze the effect of
chamfer depth variations on the diffusion zone using the scanning electron microscope–energy
dispersive x-ray (SEM–EDX) mapping characterization method. The results show that at a 2 mm
chamfer, element diffusion develops to about 5 μm with a composition of 70.26 wt% Al (84.12
at%) and 28.93 wt% Cu (14.71 at%). At a chamfer of 4 mm, the diffusion distance increased to 10
μm with a composition of 77.76 wt% Al (88.43 at%) and 21.27 wt% Cu (10.27 at%), as well as a
more even distribution of elements. Meanwhile, the 6 mm chamfer showed diffusion up to 15 μm
with a composition of 77.43 wt% Al (86.67 at%) and 20.53 wt% Cu (9.76 at%). Overall, variations
in the depth of the 30° chamfer affect the distance and character of element diffusion at the
interface, where a depth of 4 mm shows the most uniform composition distribution compared to
other variations..

Keywords: friction welding, 30° chamfer, aluminum AA6061, copper, SEM–EDX mapping, microstructure